HENAN YUMO: Engineered Precision, Uncompromised Performance
Silicon Carbide Grit: Ultimate Abrasive Guide & Industrial Applications
Explore YUMO's silicon carbide grit solutions with 99.2% purity. Achieve micron-level precision in semiconductor & aerospace applications. Free tech specs available.
5/20/20251 min read


Silicon Carbide Grit: Ultimate Abrasive Guide & Industrial Applications
H1: Silicon Carbide Grit: The Engine of Precision Grinding in Modern Manufacturing
Introduction
As global manufacturing embraces ultra-precision machining (projected $3.8B market by 2027), silicon carbide grit emerges as the cornerstone of advanced abrasives. With Mohs hardness of 9.5 and thermal stability up to 1,600°C, SiC grit enables micron-level accuracy in aerospace, semiconductor, and renewable energy sectors. This guide explores YUMO Advanced Materials' cutting-edge SiC grit solutions, achieving 99.2% purity levels through proprietary refinement processes.
Chapter 1: Manufacturing Excellence
1.1 Advanced Production Methodology Combining the traditional Acheson process with modern innovations:
Raw Material Optimization:
SiO₂ purity >99.5% (quartz sand)
Petroleum coke with fixed carbon >98%
Proprietary mixing ratio ensures stoichiometric Si:C balance
Next-Gen Furnace Design:
2,400°C electric arc furnace with graphene-coated electrodes
Real-time thermal imaging prevents β-phase formation
Intelligent Classification:
Laser particle analyzers ensure grit size conformity (F12-F600 range)
Airflow separation achieves <5% size deviation
1.2 Quality Control Protocols
ISO 8486-2024 certified testing for:
Angularity coefficient ≥1.35
Bulk density 1.6-1.8 g/cm³
Magnetic content <0.02%
Chapter 2: Technical Advantages
2.1 Performance Comparison
2.2 Unique Material Properties
Thermal Shock Resistance: Withstands 50+ rapid cooling cycles (1,200°C→25°C)
Chemical Inertness: pH stability from 2-12 without degradation
Self-Sharpening: Micro-fracture mechanism maintains cutting edges
Chapter 3: Industrial Applications
3.1 Semiconductor Wafer Processing
Edge Grinding:
0.3μm surface finish with #4000 grit
99.99% purity SiC prevents wafer contamination
CMP Slurries:
Colloidal SiC for <0.5nm Ra roughness
40% faster material removal rate vs alumina
3.2 Aerospace Component Finishing
Turbine Blade Polishing:
Maintains airfoil profile within ±5μm
60% longer tool life vs conventional abrasives
3.3 Photovoltaic Manufacturing
Solar Wafer Slicing:
Diamond-coated SiC wire saws
Kerf loss <90μm with 0.2% TTV
Particle Size Standards
Coarse Grits (F12-F80): Concrete surface preparation
Medium Grits (F100-F220): Metal deburring
Fine Grits (F240-F600): Optical polishing
Technical FAQs
Q: Why does SiC grit outperform alumina in wet grinding?
A: Superior thermal conductivity (4x higher) prevents glazing at 45°C+ operating temps
Q: How to store SiC grit for maximum shelf life?
A: Use desiccated containers at <40% humidity – oxidization rate drops 80% vs ambient storage