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Green Silicon Carbide Grit & Powder | YUMO New Material
Green Silicon Carbide (SiC≥99%, Mohs 9.5) is a premium synthetic abrasive with sharp edges and self-sharpening properties, ideal for precision optical glass polishing, monocrystalline wafer dicing, and advanced ceramic finishing, ensuring ultra-smooth surfaces with minimal substrate damage.
Green Silicon Carbide Grit (F16-F1200, SiC≥99%) delivers razor-sharp cutting edges for precision slicing of quartz glass, optical fibers, and hard alloys, outperforming alumina in surface finish and tool lifespan.
Green Silicon Carbide Micro Power
Green SiC Micro Powder (0.5-15μm, Fe₂O₃≤0.05%) enables nano-level polishing of sapphire substrates and MEMS sensors, with ultra-uniform particles minimizing micro-scratches (Ra <0.1nm achievable).
Green Silicon Carbide Grit
Products Parameter
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Grit VS. Micro Powder
Application
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💚 Green Silicon Carbide
🔧 metalworking
✅ Hard alloy precision grinding: Processing ultra-fine grain hard alloys (grain size ≤ 0.5 μ m), Ra ≤ 0.05 μ m.
🏺 Ceramics and refractory materials
✅ Precision ceramic forming: Micro powder (D50=1 μ m) is used for silicon carbide ceramic casting, with a green density uniformity of ± 1%.
💡 Electronics and Semiconductors
✅ Sapphire wafer cutting: JIS 2000 # micro powder (D50=5 μ m) achieves edge breakage ≤ 10 μ m and yield ≥ 99.5%.
✅ MEMS device polishing: Ultra low Fe micro powder (≤ 10ppm) is used for silicon microphone cavity CMP, with a removal rate of 0.8 μ m/min.
Packaging & Shipping
We can provide 1MT/25Kg woven plastic bags and 25Kg paper bags. And ton bag packaging.
All of our abrasive products are carefully processed during storage and transportation to maintain their quality in their original state.
